Precision PCBA Computer Board Engineering China Customized PCB and PCBA Solutions
Basic Info
| Model No. | PCBA-A54 |
| Assembly method | Post Welding |
| Transport package | Anti-static Packaging |
| Certification | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Definitions | IPC Class2 |
| Minimum Space/Line | 0.075mm/3mil |
| Application | Signal transmission |
| Origin | Made in China |
| Production Capacity | 720,000 M2/Year |
PCB Assembly or PCBA is a crucial process in electronics manufacturing. It involves mounting and soldering components onto a printed circuit board (PCB).
What is SMT?
Surface Mount Technology (SMT) is a method of assembling electronic circuits where components are mounted directly onto the surface of a PCB. This method involves using surface-mount devices (SMDs) such as resistors, capacitors, and integrated circuits. These components have small metal tabs or leads that are soldered directly onto the surface of the PCB.
Advantages of SMT:
One of the biggest advantages of SMT is that it allows for smaller and more compact PCB designs. SMT components are much smaller than their through-hole counterparts, which makes it possible to pack more components onto a smaller board. This is especially important in applications where space is limited, such as mobile phones, laptops, and other handheld devices.
Product Description
PCBA Capabilities
| 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0201 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
Capability - SMT
|
Lines |
9(5 Yamaha,4KME) |
|
Capacity |
52 million placements per month |
|
Max Board Size |
457*356mm.(18”X14”) |
|
Min Component size |
0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
|
Speed |
0.15 sec/chip,0.7 sec/QFP |
Capability - PTH
|
Lines |
2 |
|
Max board width |
400 mm |
|
Type |
Dual wave |
|
Pbs status |
Lead-free line support |
|
Max temp |
399 degree C |
|
Spray flux |
add-on |
|
Pre-heat |
3 |
Q/T Lead Time
| Category | Quickest Lead Time | Normal Lead Time |
| Double-sided | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
Quality Control
| AOI Testing | Checks for solder pasteChecks for components down to 0201
Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test | Advanced Function TestFlash Device Programming
Functional testing |
- IOC incoming inspection
- SPI solder paste inspection
- Online AOI inspection
- SMT first article inspection
- External assessment
- X-RAY-welding inspection
- BGA device rework
- QA inspection
- Anti-static warehousing and shipment
FAQ
A:
Bill of materials (BOM) detailing:
a), Manufacturers parts numbers,
b), Components suppliers' parts number (e.g. Digi-key, Mouser, RS )
c), PCBA sample photos if possible.
d), Quantity
A: Free samples depend on your order quantity.
A:
No, we can't accpet picture files, if you no not have gerber file, can you send us sample to copy it.
PCB&PCBA Copy Process：
A:
Our Quality Assuring Procedures as below:
a),Visual Inspection
b),Flying probe, fixture tool
c), Impedance control
d), Solder-ability detection
e), Digital metallograghic microscope
f),AOI (Automated Optical Inspection)
A: Please send the details inquiry to us, such as the Item Number, Quantity for each item, Quality request, Logo, Payment Terms, Transport method, Discharge place, etc. We will make an accurate quotation for you as soon as possible.
A: Each Customer will have a sale to contact with you. Our working hours: AM 9:00-PM 19:00(Beijing Time) from Monday to Friday. We will reply to your email as soon as quickly during our working time. And you also could contact our sales by cellphone if urgent.
| Production capacity of hot-sale products | |
| Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
| Technical Capability | Technical Capability |
| Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
| Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
| Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole size: 0.1mm(dirilling hole) | Min. Hole size: 12mil(0.3mm) |
| Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
| Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
| Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
| NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
| Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
| Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
| Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
| Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
A: yes, We have a professional drawing engineers' team that you can trust.
A: Yes, we ensure that each piece of PCB, and PCBA will be tested before shipment, and we ensure the goods we sent with good quality.
Our Quality Assuring Procedures as below:
a),Visual Inspection
b),Flying probe, fixture tool
c), Impedance control
d), Solder-ability detection
e), Digital metallograghic microscope
f),AOI (Automated Optical Inspection)
·With ABIS, customers significantly and effectively reduce their global procurement costs. Behind each service provided by ABIS, is hidden a cost-saving for customers.
. We have two shops together, one is for prototype, quick turn, and small volume making. The other is for mass production also for the HDI board, with highly skilled professional employees, for high-quality products with competitive prices and on-time delivery.
. We provide very professional sales, technical and logistic support, on a worldwide basis with 24 hours of complaint feedback.
